chip emi filters design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. & 1 product code type circuit nominal capacitance value form 9 2 $ 3 $ 4 & 5 5 6 7 8 9 6 10 noise filter chip type t-circuit emi ?lter the ?rst two digits are signi?cant ?gures of capacitance value and the third one denotes the number of zeros following. code u packing embossed carrier taping ferrite core chip capacitor adhesive electrode 1.80.2 2.70.3 0.50.2 4.50.4 0.50.2 1.00.2 size : 1807 inch mass (weight) : 92.5 mg/pc. construction dimensions in mm (not to scale) chip emi filters type: exccet features rated current (2 a max.) eight capacitance values in a wide range, related to the noise frequency suitable for narrow pitch insertion suitable for applications requiring thin design rohs compliant explanation of part numbers recommended applications digital equipment such as pcs, word processors, printers, hdd, ppc and communication equipment. digital audio and video equipment. ac adapters and switching power supplies. electronic musical instruments and other digital equipment. nov. 2012 02
chip emi filters design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. measurement circuit ~ 50 ? 50 ? sample 1m 10m 100m 1g frequency (hz) attenuation(db) 60 50 40 30 20 10 0 471 220 470 101 103 222 102 271 t 2 chip component p 1 p 2 p 0 compartment sprocket hole fd 0 tape running direction f w b a t f c e f d f b w f a 0 a 0 b 0 c 0 d dimensions (mm) 180.0 0 60.01.0 13.00.5 21.00.8 part number rated voltage (v dc) (1) capacitance (pf) toler- ance (%) (2) characteristics rated current (a dc) dc resistance (m ) 25 db attenuate frequency (mhz) 15 db attenuate frequency (mhz) exccet220u 50 22 20 yb 2 50 max. 800 to 1000 600 to 1000 exccet470u 50 47 20 yb 2 50 max. 450 to 550 350 to 1000 exccet101u 50 100 20 yb 2 50 max. 300 to 450 200 to 900 exccet271u 50 270 20 yb 2 50 max. 200 to 300 80 to 700 exccet471u 50 470 20 yb 2 50 max. 100 to 220 50 to 700 exccet102u 50 1000 20 yb 2 50 max. 65 to 200 30 to 700 exccet222u 50 2200 20 yb 2 50 max. 35 to 180 15 to 700 exccet103u 50 10000 20 yb 2 50 max. 15 to 120 15 to 700 part number kind of taping pitch (p 1 )q u a n t i t y exccet u embossed carrier taping 4 mm 1000 pcs./reel packaging methods (taping) standard quantity taping reel embossed carrier taping abwfp 1 dimensions (mm) 2.2 0.2 4.9 0.2 12.0 0.2 5.50 0.05 4.0 0.1 p 2 p 0 0 d 0 t 2 dimensions (mm) 2.0 0.1 4.0 0.1 1.5 0.1 3.5 max. C3.0 ewt dimensions (mm) 2.00.5 13.01.0 16.5 max. (1) please inquire to us about the particular capacitance value, on a range of 22 to 10000 pf. (2) characteristics yb: maximum capacitance is 10 % over the temperature range of ?25 c to +85 c in reference to +20 c. attenuation characteristics (reference data) ratings category temperature range C40 c to +85 c nov. 2012 02
chip emi filters design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 5.4 1.3 1.3 1.15 1.0 0.2 copper foil resist 1.4 1.15 1.0 0.2 copper foil resist 1.4 5.4 1.3 1.3 1.4 resist 2.54 preheating peak heating temperature time recommended land pattern design(mm) for single mounting for high density mounting recommended soldering conditions recommendations and precautions are described below. preheat with a blast of hot air or similar method. use a soldering iron with a tip temperature of 350 c or less. solder each electrode for 3 seconds or less. never touch this product with the tip of a soldering iron. temperature time preheating 140 c to 160 c 60 s to 120 s main heating above 200 c 30 s to 40 s peak 235 10 c max. 10 s temperature time preheating 150 c to 170 c 60 s to 120 s main heating above 230 c 30 s to 40 s peak max. 260 c max. 10 s recommended soldering conditions for re? ow for soldering (example : sn-37pb) for lead-free soldering (example : sn/3ag/0.5cu) re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. safety precautions the following are precautions for individual products. please also refer to the common precautions for noise suppression device shown on this catalog. 1. use rosin-based ? ux or halogen-free ? ux. 2. for cleaning, use an alcohol-based cleaning agent. before using any other type, con sult with our sales person in advance. 3. do not apply shock to chip emi filters (hereafter called the ? lters) or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, their bodies may be chipped, affecting their performance. excessive mechanical stress may damage the filters. handle with care. 4. avoid applying static electricity to the ? lters. 5. the performance of the ? lters deteriorates in a circuit that is susceptible to surges or other abnormal voltages. carefully check the circuit operations before use. 6. store the ? lters in a location with a temperature ranging from C 5 c to +40 c and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 7. use the ? lters within a year after the date of the outgoing inspection indicated on the packages. using the land pattern which we do not recommend, o r mounting by the solder under 180 m, verify the performance, reliability, etc. thoroughly. flow soldering chip emi filters cannot be mounted on a printed circuit board by ? ow soldering. mount them by re? ow soldering. nov. 2012 02
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